Tag Archives: Intel

Intel announces a new security feature, ‘Control-Flow Enforcement’ Tech to mitigate common Malware threats

Intel today announced a new security capability, dubbed as Intel Control-Flow Enforcement Technology (Intel CET), which will be first available on the upcoming mobile processor ‘Tiger Lake’. Intel’s CET plans to deliver CPU-level security capabilities to help protect against common “malware attack” methods, which have been challenging to mitigate in the past, even with software. Continue reading Intel announces a new security feature, ‘Control-Flow Enforcement’ Tech to mitigate common Malware threats

ASRock’s “Base Frequency Boost” tech helps boost Gaming performance & CPU benchmark scores

ASRock has once again highlighted the benefits of its BFB overclocking feature for non-K CPUs in this latest video. In case you didn’t know, ASRock is allowing overclocking on non-K Comet Lake S CPUs, and non-Z motherboards, mostly the Z490/B460/H470/Z390/B365 chipsets. Continue reading ASRock’s “Base Frequency Boost” tech helps boost Gaming performance & CPU benchmark scores

Intel’s “Rocket Lake-S” desktop CPUs rumored to feature a “Multi-Chip Module” of 14nm Core & 10nm Uncore Dies

Rocket Lake (RKL) is a planned microarchitecture designed by Intel as a direct successor to the Comet Lake-S series of  desktop CPUs and high-performance mobile devices. These were expected to hit the market by the end of this year, but Intel’s roadmap has no mention of this. Continue reading Intel’s “Rocket Lake-S” desktop CPUs rumored to feature a “Multi-Chip Module” of 14nm Core & 10nm Uncore Dies

Intel launches Lakefield Hybrid CPUs with “Foveros 3D Stacking” for low-power devices & foldable dual-screen PCs

Intel finally brings 3D processors by launching hybrid “Lakefield” chips. Lakefield is the first mobile processor from Intel to use their Foveros 3D packaging technology. Lakefield is the first hybrid processor family to make use of the Foveros chip stacking tech. These are meant for thin ultra-light compact form factor Laptops and similar devices, such as dual-screen PCs. Continue reading Intel launches Lakefield Hybrid CPUs with “Foveros 3D Stacking” for low-power devices & foldable dual-screen PCs

INTEL’s future Alder Lake-S CPU architecture to feature CLDEMOTE “cache line demote” instruction set

According to one recent Tweet posted by @InstLatX64, INTEL’s future upcoming ALDER LAKE micro architecture is going to support a new instruction set which can help speed up the processor’s cache performance. This is called CLDEMOTE, or “cache line demote”. Continue reading INTEL’s future Alder Lake-S CPU architecture to feature CLDEMOTE “cache line demote” instruction set

Don’t expect INTEL to launch next-Gen “Core-S” and “Core-X” CPUs this year, including Rocket Lake-S lineup for the desktop platform

According to one recent roadmap posted on ROG.Forums, coming via @9550pro and Videocardz, there is no mention of INTEL’s plans to release their next-gen CPUs this year. Continue reading Don’t expect INTEL to launch next-Gen “Core-S” and “Core-X” CPUs this year, including Rocket Lake-S lineup for the desktop platform